Datasheet

LPC1315_16_17_45_46_47 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 3 — 20 September 2012 3 of 77
NXP Semiconductors
LPC1315/16/17/45/46/47
32-bit ARM Cortex-M3 microcontroller
 Processor wake-up from Deep-sleep and Power-down modes via reset, selectable
GPIO pins, watchdog interrupt, or USB port activity.
 Processor wake-up from Deep power-down mode using one special function pin.
 Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, Power-down, and Deep power-down modes.
 Power-On Reset (POR).
 Brownout detect with up to four separate thresholds for interrupt and forced reset.
 Unique device serial number for identification.
 Single 3.3 V power supply (2.0 V to 3.6 V).
 Temperature range 40 C to +85 C.
 Available as LQFP64, LQFP48, and HVQFN33 package.
3. Applications
4. Ordering information
 Consumer peripherals  Handheld scanners
 Medical  USB audio devices
 Industrial control
Table 1. Ordering information
Type number Package
Name Description Version
LPC1345FHN33 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7  7  0.85 mm
n/a
LPC1345FBD48 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC1346FHN33 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7  7  0.85 mm
n/a
LPC1346FBD48 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC1347FHN33 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7  7  0.85 mm
n/a
LPC1347FBD48 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC1347FBD64 LQFP64 LQFP64: plastic low profile quad flat package; 64 leads; body 10  10 
1.4 mm
SOT314-2
LPC1315FHN33 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7  7  0.85 mm
n/a
LPC1315FBD48 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC1316FHN33 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7  7  0.85 mm
n/a
LPC1316FBD48 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC1317FHN33 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7  7  0.85 mm
n/a
LPC1317FBD48 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC1317FBD64 LQFP64 LQFP64: plastic low profile quad flat package; 64 leads; body 10  10 
1.4 mm
SOT314-2