Datasheet

LPC1311_13_42_43 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 6 June 2012 68 of 74
NXP Semiconductors
LPC1311/13/42/43
32-bit ARM Cortex-M3 microcontroller
Fig 41. Reflow soldering of the HVQFN33 package
Footprint information for reflow soldering of HVQFN33 package
001aao134
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
Remark:
Stencil thickness: 0.125 mm
e = 0.65
evia = 4.25
OwDtot = 5.10 OA
PID = 7.25 PA+OA
OID = 8.20 OA
0.20 SR
chamfer (4×)
0.45 DM
evia = 1.05
W = 0.30 CU
evia = 4.25
evia = 2.40
LbE = 5.80 CU
LbD = 5.80 CU
PIE = 7.25 PA+OA
LaE = 7.95 CU
LaD = 7.95 CU
OIE = 8.20 OA
OwEtot = 5.10 OA
EHS = 4.85 CU
DHS = 4.85 CU
4.55 SR
4.55 SR
B-side
(A-side fully covered)
number of vias: 20
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
SEhtot = 2.70 SP
SDhtot = 2.70 SP
GapE = 0.70 SP
SPE = 1.00 SP
0.45 DM
SPD = 1.00 SP
GapD = 0.70 SP