Datasheet

LPC1311_13_42_43 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 6 June 2012 67 of 74
NXP Semiconductors
LPC1311/13/42/43
32-bit ARM Cortex-M3 microcontroller
13. Soldering
Fig 40. Reflow soldering of the LQFP48 package
SOT313-2
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP48 package
Ax
Bx
Gx
Gy
Hy
Hx
AyBy
P1
D2 (8×)
D1
(0.125)
Ax Ay Bx By D1 D2 Gx Gy Hx Hy
10.350
P2
0.560 10.350 7.350 7.350
P1
0.500 0.280
C
1.500 0.500 7.500 7.500 10.650 10.650
sot313-2_fr
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout
P2