Datasheet

LPC12D27 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 20 September 2011 41 of 46
NXP Semiconductors
LPC12D27
32-bit ARM Cortex-M0 microcontroller
14. Soldering
Fig 25. Reflow soldering of the LQFP100 package
SOT407-1
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP100 package
Ax
Bx
Gx
Gy
Hy
Hx
AyBy
P1P2
D2 (8×) D1
(0.125)
Ax Ay Bx By D1 D2 Gx Gy Hx HyP1 P2 C
sot407-1
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout
17.300 17.300 14.300 14.3000.500 0.560 0.2801.500 0.400 14.500 14.500 17.550 17.550