Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller LQFP 100 (14x14) 32-Bit 45 MHz I/O number 40

1. General description

The LPC12D27 are ARM Cortex-M0 based microcontrollers for embedded applications

featuring a high level of integration and low power consumption. The ARM Cortex-M0 is a

next generation core that offers system enhancements such as enhanced debug features

and a higher level of support block integration.

The LPC12D27 is a dual-chip module consisting of a LPC1227 single-chip microcontroller

combined with a PCF8576D Universal LCD driver in a low-cost 100-pin package. The

LCD driver provides 40 segments and supports from one to four backplanes. Display

overhead is minimized by an on-chip display RAM with auto-increment addressing.

The LPC12D27 operate at CPU frequencies of up to 45 MHz and include 128 kB of flash

memory and 8 kB of data memory.

The peripheral complement of the LPC1227 microcontroller includes a micro DMA

controller, one Fast-mode Plus I

C interface, one SSP interface, two UARTs, four general

purpose timers, a 10-bit ADC, two comparators, and up to 40 general purpose I/O pins.

Remark: For a functional description of the LPC1227 microcontroller see the LPC122x

data sheet. For a detailed description of the LCD driver see the PCF8576D data sheet.

Both data sheets are available at http://www.nxp.com/microcontrollers

2. Features and benefits

 LCD driver

 40 segments.

 One to four backplanes.

 On-chip display RAM with auto-increment addressing.

 Processor core

 ARM Cortex-M0 processor, running at frequencies of up to 45 MHz (one wait state

from flash) or 30 MHz (zero wait states from flash). The LPC12D27 have a high

score of over 45 in CoreMark CPU performance benchmark testing, equivalent to

1.51/MHz.

 ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC).

 Serial Wire Debug (SWD).

 System tick timer.

 Memory

 8 kB SRAM.

 128 kB on-chip flash programming memory.

LPC12D27

32-bit ARM Cortex-M0 microcontroller; 128 kB flash and 8 kB

SRAM; 40 segment x 4 LCD driver

Rev. 1 — 20 September 2011 Product data sheet

Summary of content (46 pages)

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LPC12D27 32-bit ARM Cortex-M0 microcontroller; 128 kB flash and 8 kB SRAM; 40 segment x 4 LCD driver Rev. 1 — 20 September 2011 Product data sheet 1. General description The LPC12D27 are ARM Cortex-M0 based microcontrollers for embedded applications featuring a high level of integration and low power consumption. The ARM Cortex-M0 is a next generation core that offers system enhancements such as enhanced debug features and a higher level of support block integration.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller        LPC12D27 Product data sheet  In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software.  Includes ROM-based 32-bit integer division routines. Clock generation unit  Crystal oscillator with an operating range of 1 MHz to 25 MHz.  12 MHz Internal RC (IRC) oscillator trimmed to 1 % accuracy that can optionally be used as a system clock.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 3. Applications      White goods Portable medical devices Lighting control Thermostats Alarm systems 4. Ordering information Table 1. Ordering information Type number Package Name LPC12D27FBD100/301 LQFP100 Description Version plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1 4.1 Ordering options Table 2.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 5. Block diagram S[39:0] PIO0, PIO1, PIO2 BP[3:0] PCF8576D LPC1227 LCD CONTROLLER MCU VLCD Fig 1. LPC12D27 Product data sheet LCD_SCL, LCD_SDA SCL, SDA 002aaf672 LPC12D27 block diagram All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 September 2011 © NXP B.V. 2011. All rights reserved.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller XTALIN XTALOUT RESET SWD LPC1227 CLOCK GENERATION, POWER CONTROL, SYSTEM FUNCTIONS clocks and controls TEST/DEBUG INTERFACE ARM CORTEX-M0 MICRO DMA CONTROLLER system bus 128 kB FLASH master 8 kB SRAM slave CLKOUT ROM slave slave AHB-LITE BUS slave GPIO ports SCK SSEL MISO MOSI RXD0 TXD0 DTR0, DSR0, CTS0, DCD0, RI0, RTS0 HIGH-SPEED GPIO AHB-ABB BRIDGE CRC ENGINE ACMP0/1_I[3:0] COMPARATOR0/1 VREF_CMP UART1 WINDOWED WDT
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller BP0 BP2 BP1 S0 to S39 BP3 40 VLCD DISPLAY SEGMENT OUTPUTS BACKPLANE OUTPUTS LCD VOLTAGE SELECTOR DISPLAY REGISTER OUTPUT BANK SELECT AND BLINK CONTROL DISPLAY CONTROLLER LCD BIAS GENERATOR VSS(LCD) CLK SYNC OSC CLOCK SELECT AND TIMING BLINKER TIMEBASE OSCILLATOR POWER-ON RESET INPUT FILTERS I2C-BUS CONTROLLER DISPLAY RAM 40 x 4-BIT PCF8576D COMMAND DECODER WRITE DATA CONTROL DATA POINTER AND AUTO INCREMENT VDD LCD_
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 6. Pinning information 77 S31 76 S30 78 S32 79 S33 80 R/PIO1_1 81 PIO1_2 82 PIO1_3 83 PIO1_4 84 PIO1_5 85 PIO1_6 86 VSS 87 VDD(3V3) 88 RTCXOUT 89 RTCXIN 90 VDD(IO) 91 VSSIO 92 XTALIN 93 XTALOUT 94 VREF_CMP 95 PIO0_19 96 PIO0_20 97 PIO0_21 98 PIO0_22 99 PIO0_23 100 PIO0_24 6.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 6.2 Pin description All pins except the supply pins and the LCD pins can have more than one function as shown in Table 3. The pin function is selected through the pin’s IOCON register in the IOCONFIG block. The multiplexed functions include the counter/timer inputs and outputs, the UART receive, transmit, and control functions, and the serial wire debug functions.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 3.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 3.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 3. LPC12D27 LQFP100 pin description …continued Symbol Pin Start Reset logic state input [1] Type Description SWDIO/ACMP1_I2/ CT32B1_CAP2/ CT32B1_MAT2/PIO0_25 1[5] no I/O SWDIO — Serial wire debug input/output, default location. I ACMP1_I2 — Input 2 for comparator 1. I CT32B1_CAP2 — Capture input, channel 2 for 32-bit timer 1. O CT32B1_MAT2 — Match output, channel 2 for 32-bit timer 1.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 3. LPC12D27 LQFP100 pin description …continued Symbol Pin R/PIO1_1/AD3 80[5] no PIO1_2/SWDIO/AD4 PIO1_3/AD5/WAKEUP 81[5] 82[6] Start Reset logic state input [1] no no PIO1_4/AD6 83[5] no PIO1_5/AD7/ CT16B1_CAP0/ CT16B1_MAT0 84[5] PIO1_6/CT16B1_CAP1/ CT16B1_MAT1 85[2] no no I; PU I; PU I; PU I; PU I; PU I; PU PIO2_0 Type Description I R — Reserved. Configure for an alternate function in the IOCONFIG block.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 3. LPC12D27 LQFP100 pin description …continued Symbol Pin Start Reset logic state input [1] Type Description S2 48 - VLCD[8] O LCD segment output. S3 49 - VLCD[8] O LCD segment output. S4 50 - VLCD[8] O LCD segment output. - VLCD[8] O LCD segment output. - VLCD[8] O LCD segment output. S5 S6 51 52 S7 53 - VLCD[8] O LCD segment output. S8 54 - VLCD[8] O LCD segment output.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 3. LPC12D27 LQFP100 pin description …continued Symbol Pin Start Reset logic state input [1] Type Description BP1 44 - VLCD[8] O LCD backplane output. BP2 43 - VLCD[8] O LCD backplane output. BP3 45 - VLCD[8] O LCD backplane output. I/O I2C-bus serial data input/output. I2C-bus serial clock input. LCD_SDA 35 - [8] LCD_SCL 36 - [8] I/O SYNC 37 - [8] I/O Cascade synchronization input/output.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 7.2.2 Functional description The PCF8576D is a versatile peripheral device interfacing the LPC1227 microcontroller with a wide variety of LCDs. It can directly drive any static or multiplexed LCD containing up to four backplanes and up to 40 segments. The possible display configurations of the PCF8576D depend on the number of active backplane outputs required. A selection of display configurations is shown in Table 4.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 7.2.6 Timing The PCF8576D timing controls the internal data flow of the device. This includes the transfer of display data from the display RAM to the display segment outputs. In cascaded applications, the correct timing relationship between each PCF8576D in the system is maintained by the synchronization signal at pin SYNC. The timing also generates the LCD frame signal whose frequency is derived from the clock frequency.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions VDD(3V3) supply voltage (3.3 V) VDD(IO) input/output supply voltage VI input voltage on all digital pins [2] on pins PIO0_10 and PIO0_11 (I2C-bus pins) IDD supply current Min Max Unit 3.0 3.6 V 3.0 3.6 V 0.5 +3.6 V 0 5.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 9. Thermal characteristics 9.1 Thermal characteristics The average chip junction temperature, Tj (C), can be calculated using the following equation: T j = T amb +  P D  R th  j – a   (1) • Tamb = ambient temperature (C), • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation The internal power dissipation is the product of IDD and VDD.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 10. Static characteristics Table 7. Static characteristics Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit VDD(IO) input/output supply voltage on pin VDD(IO) 3.0 3.3 3.6 V VDD(3V3) supply voltage (3.3 V) 3.0 3.3 3.6 V IDD supply current CCLK = 12 MHz - 4.6 - mA CCLK = 24 MHz - 9 - mA CCLK = 33 MHz - 12.2 - mA CCLK = 12 MHz - 6.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 7. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter VIL LOW-level input voltage Vhys hysteresis voltage VOH HIGH-level output voltage VOL IOH LOW-level output voltage HIGH-level output current Conditions Min Typ[1] Max Unit - - 0.3VDD(IO) V - 0.4 - V low mode; IOH = 2 mA VDD(IO)  0.4 - - V high mode; IOH = 4 mA VDD(IO)  0.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 7. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit IOH HIGH-level output current low mode; VOH = VDD(IO)  0.7 20 - - mA high mode; VOH = VDD(IO)  0.7 28 - - mA VOL = 0.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 10.1 Peripheral power consumption The supply current per peripheral is measured as the difference in supply current between the peripheral block enabled and the peripheral block disabled in the SYSAHBCLKCFG and PDRUNCFG (for analog blocks) registers. All other blocks are disabled in both registers and no code is executed. Measured on a typical sample at Tamb = 25 C and VDD(3V3) = 3.3 V. Table 8.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 002aag186 16 IDD (mA) 33 MHz(2) 12 24 MHz(2) 8 12 MHz 4 (1) 4 MHz(3) (3) 1 MHz 0 3 3.2 3.4 3.6 VDD(3V3) (V) Conditions: Tamb = 25 C; active mode entered executing code while(1){} from flash; all peripherals disabled in the SYSAHBCLKCTRL register; all peripheral clocks disabled; internal pull-up resistors disabled; BOD disabled. (1) System oscillator and system PLL disabled; IRC enabled.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 002aag187 16 33 MHz(2) IDD (mA) 12 24 MHz 8 (2) 12 MHz(1) 4 MHz(3) (3) 1 MHz 4 0 3 3.2 3.4 3.6 VDD(3V3) (V) Conditions: Tamb = 25 C; active mode entered executing code while(1){} from flash; all peripherals enabled in the SYSAHBCLKCTRL register. (1) System oscillator and system PLL disabled; IRC enabled. (2) System oscillator and system PLL enabled; IRC disabled.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 002aag188 5 33 MHz IDD (mA) (2) 4 24 MHz(2) 3 2 1 12 MHz (1) 4 MHz(3) 1 MHz(3) 0 3.0 3.2 3.4 3.6 VDD(3V3) (V) Conditions: VDD(3V3) = 3.3 V; sleep mode entered from flash; all peripherals disabled in the SYSAHBCLKCTRL register (SYSAHBCLKCTRL = 0x1F); all peripheral clocks disabled; internal pull-up resistors disabled; BOD disabled. (1) System oscillator and system PLL disabled; IRC enabled.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 002aag189 1.0 IDD (μA) 0.9 0.8 VDD(3V3) = 3.6 V 3.3 V 3.0 V 0.7 0.6 -40 -15 10 35 60 85 temperature (°C) Fig 11. Deep power-down mode: Typical supply current IDD versus temperature for different supply voltages VDD(3V3) 10.3 Electrical pin characteristics 002aag175 3.6 VOH (V) 3.2 low mode -40 °C +25 °C +70 °C +85 °C low mode -40 °C +25 °C +70 °C +85 °C 2.8 2.4 2 0 16 32 48 IOH (mA) Conditions: VDD(IO) = 3.3 V Fig 12.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 002aag310 1.2 VOL (V) high mode -40 °C +25 °C +70 °C +85 °C low mode -40 °C +25 °C +70 °C +85 °C 0.8 0.4 0 0 16 32 48 IOL (mA) Conditions: VDD(IO) = 3.3 V Fig 13. High-drive pins: Typical LOW-level output voltage VOL versus LOW-level output current IOL 002aag180 0.8 VOL (V) -40 °C +25 °C +70 °C +85 °C 0.6 0.4 0.2 0 0 12 24 36 48 IOL (mA) Conditions: VDD(IO) = 3.3 V. Fig 14.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 002aag181 1.2 VOL (V) -40 °C +25 °C +70 °C +85 °C low mode high mode -40 °C +25 °C +70 °C +85 °C 0.8 0.4 0 0 4 8 12 16 IOL (mA) Conditions: VDD(IO) = 3.3 V. Fig 15. Normal-drive pins: Typical LOW-level output voltage VOL versus LOW-level output current IOL 002aag182 3.4 high mode VOH (V) 3.0 -40 °C +25 °C +70 °C +85 °C low mode -40 °C +25 °C +70 °C +85 °C 2.6 2.2 1.8 0 4 8 12 16 IOH (mA) Conditions: VDD(IO) = 3.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 002aag185 0 Ipu (mA) -20 -40 +85 °C +70 °C +25 °C -40 °C -60 -80 -100 0 1 2 3 VI (mA) Conditions: VDD(IO) = 3.3 V. Fig 17. Typical pull-up current Ipu versus input voltage VI LPC12D27 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 September 2011 © NXP B.V. 2011. All rights reserved.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 10.4 ADC characteristics Table 9. ADC static characteristics Tamb = 40 C to +85 C unless otherwise specified; ADC frequency 9 MHz, VDD(3V3) = 3.0 V to 3.6 V. Parameter VIA analog input voltage 0 - VDD(3V3) V Cia analog input capacitance - - 1 pF ED differential linearity error [2][3][4] - - 1 LSB integral non-linearity [2][5] - -  2.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller offset error EO gain error EG 1023 1022 1021 1020 1019 1018 (2) 7 code out (1) 6 5 (5) 4 (4) 3 (3) 2 1 LSB (ideal) 1 0 1 2 3 4 5 6 7 1018 1019 1020 1021 1022 1023 1024 VIA (LSBideal) offset error EO 1 LSB = VDD(3V3) − VSS 1024 002aae787 (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)).
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 10.5 BOD static characteristics Table 10. BOD static characteristics[1] Tamb = 25 C. Symbol Parameter Conditions Vth threshold voltage interrupt level 1 Min Typ Max Unit assertion - 2.25 - V de-assertion - 2.39 - V assertion - 2.54 - V de-assertion - 2.67 - V assertion - 2.83 - V de-assertion - 2.93 - V assertion - 2.04 - V de-assertion - 2.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 11. Dynamic characteristics 11.1 Power-up ramp conditions Table 11. Power-up characteristics Tamb = 40 C to +85 C. Symbol Parameter tr rise time twait wait time VI input voltage Conditions Min at t = t1: 0 < VI 400 mV [1] [1][2] at t = t1 on pin VDD Typ Max Unit 0 - 500 ms 12 - - s 0 - 400 mV [1] See Figure 19.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 11.2 Flash memory Table 12. Dynamic characteristics: flash memory Tamb = 40 C to +85 C; VDD(3V3) over specified ranges.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 11.4 Internal oscillators Table 14. Dynamic characteristics: internal oscillators Tamb = 40 C to +85 C; VDD(3V3) over specified ranges.[1] Symbol Parameter Conditions Min Typ[2] Max Unit fosc(RC) internal RC oscillator frequency - 11.88 12 12.12 MHz [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 11.5 I2C-bus Table 16. Dynamic characteristics: I2C-bus pins Tamb = 40 C to +85 C.[1] Symbol Parameter Conditions Min Max Unit fSCL SCL clock frequency Standard-mode 0 100 kHz Fast-mode 0 fall time tf [2][3][4][5] 400 kHz Fast-mode Plus 0 1 MHz of both SDA and SCL signals - 300 ns Fast-mode 20 + 0.1  Cb 300 ns Fast-mode Plus - 120 ns Standard-mode 4.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller tf SDA tSU;DAT 70 % 30 % 70 % 30 % tHD;DAT tf 70 % 30 % SCL tVD;DAT tHIGH 70 % 30 % 70 % 30 % 70 % 30 % tLOW S 1 / fSCL 002aaf425 Fig 22. I2C-bus pins clock timing LPC12D27 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 September 2011 © NXP B.V. 2011. All rights reserved.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 12. Application information 12.1 XTAL input The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a clock in slave mode, it is recommended that the input be coupled through a capacitor with Ci = 100 pF. To limit the input voltage to the specified range, choose an additional capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg).
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 12.3 ElectroMagnetic Compatibility (EMC) Radiated emission measurements according to the IEC61967-2 standard using the TEM-cell method are shown for the LPC1227FBD64/301 in Table 17. Table 17. ElectroMagnetic Compatibility (EMC) for part LPC1227FBD64/301 (TEM-cell method) VDD = 3.3 V; Tamb = 25 C. Parameter Frequency band System clock = Unit 12 MHz 24 MHz 33 MHz 150 kHz - 30 MHz 4.2 3.8 6.4 dBV 30 MHz - 150 MHz 7.3 5.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 13. Package outline LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 c y X A 51 75 50 76 ZE e E HE A A2 (A 3) A1 w M θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 14.1 13.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 14. Soldering Footprint information for reflow soldering of LQFP100 package SOT407-1 Hx Gx P2 Hy (0.125) P1 Gy By Ay C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.500 P2 Ax Ay Bx By 0.560 17.300 17.300 14.300 14.300 C D1 D2 1.500 0.280 0.400 Gx Gy Hx Hy 14.500 14.500 17.550 17.550 sot407-1 Fig 25.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 15. References LPC12D27 Product data sheet [1] LPC122x data sheet, http://www.nxp.com/microcontrollers [2] PCF8576D data sheet, http://www.nxp.com/microcontrollers All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 September 2011 © NXP B.V. 2011. All rights reserved.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 16. Revision history Table 18. Revision history Document ID Release date Data sheet status Change notice Supersedes LPC12D27 v.1 20110920 Product data sheet - - LPC12D27 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 September 2011 © NXP B.V. 2011. All rights reserved.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.
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LPC12D27 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 19. Contents 1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 7.2 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 7.2.5.1 7.2.6 7.2.7 7.2.8 7.2.9 7.2.10 8 9 9.1 10 10.1 10.2 10.3 10.4 10.5 11 11.1 11.2 11.3 11.4 11.5 12 12.1 12.2 12.3 13 14 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ordering information . . . . . . . . .