Datasheet
LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 2.2 — 11 March 2014 3 of 77
NXP Semiconductors
LPC11U3x
32-bit ARM Cortex-M0 microcontroller
Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, Power-down, and Deep power-down modes.
Power profiles residing in boot ROM provide optimized performance and minimized
power consumption for any given application through one simple function call.
Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep
power-down.
Processor wake-up from Deep-sleep and Power-down modes via reset, selectable
GPIO pins, watchdog interrupt, or USB port activity.
Processor wake-up from Deep power-down mode using one special function pin.
Power-On Reset (POR).
Brownout detect with up to four separate thresholds for interrupt and forced reset.
Unique device serial number for identification.
Single 3.3 V power supply (1.8 V to 3.6 V).
Temperature range 40 C to +85 C.
Available as LQFP64, LQFP48, TFBGA48, and HVQFN33 packages.
3. Applications
4. Ordering information
Consumer peripherals Handheld scanners
Medical USB audio devices
Industrial control
Table 1. Ordering information
Type number Package
Name Description Version
LPC11U34FHN33/311 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7 7 0.85 mm
n/a
LPC11U34FBD48/311 LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm SOT313-2
LPC11U34FHN33/421 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7 7 0.85 mm
n/a
LPC11U34FBD48/421 LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm SOT313-2
LPC11U35FHN33/401 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7 7 0.85 mm
n/a
LPC11U35FBD48/401 LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm SOT313-2
LPC11U35FBD64/401 LQFP64 plastic low profile quad flat package; 64 leads; body 10 10 1.4 mm SOT314-2
LPC11U35FHI33/501 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 5 5 0.85 mm
n/a
LPC11U35FET48/501 TFBGA48 plastic thin fine-pitch ball grid array package; 48 balls; body 4.5 4.5
0.7 mm
SOT1155-2
LPC11U36FBD48/401 LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm SOT313-2
LPC11U36FBD64/401 LQFP64 plastic low profile quad flat package; 64 leads; body 10 10 1.4 mm SOT314-2