Datasheet

LPC11U2X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
Product data sheet Rev. 2.3 — 27 March 2014 67 of 74
NXP Semiconductors
LPC11U2x
32-bit ARM Cortex-M0 microcontroller
Fig 42. Reflow soldering for the TFBGA48 package
DIMENSIONS in mm
PSLSPSRHxHy
Hx
Hy
SOT1155-2
solder land plus solder paste
occupied area
Footprint information for reflow soldering of TFBGA48 package
solder land
solder paste deposit
solder resist
P
P
SL
SP
SR
detail X
see detail X
0.50 0.225 0.275 0.325 4.75 4.75
sot1155-2_fr