Datasheet

LPC11E6X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1.2 — 21 May 2014 42 of 89
NXP Semiconductors
LPC11E6x
32-bit ARM Cortex-M0+ microcontroller
[6] An ADC input voltage above 3.6 V can be applied for a short time without leading to immediate, unrecoverable failure. Accumulated
exposure to elevated voltages at 4.6 V must be less than 10
6
s total over the lifetime of the device. Applying an elevated voltage to the
ADC inputs for a long time affects the reliability of the device and reduces its lifetime.
[7] It is recommended to connect an overvoltage protection diode between the analog input pin and the voltage supply pin.
[8] Dependent on package type.
[9] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
10. Thermal characteristics
The average chip junction temperature, T
j
(C), can be calculated using the following
equation:
(1)
• T
amb
= ambient temperature (C),
• R
th(j-a)
= the package junction-to-ambient thermal resistance (C/W)
• P
D
= sum of internal and I/O power dissipation
The internal power dissipation is the product of I
DD
and V
DD
. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 7. Thermal resistance value (C/W): ±15 %
Symbol Parameter Conditions Typ Unit
LQFP48
ja thermal resistance
junction-to-ambient
JEDEC (4.5 in  4 in)
0 m/s 67 C/W
1 m/s 58 C/W
2.5 m/s 53 C/W
8-layer (4.5 in  3 in)
0 m/s 100 C/W
1 m/s 79 C/W
2.5 m/s 71 C/W
jc thermal resistance junction-to-case 15 C/W
jb thermal resistance junction-to-board 19 C/W
LQFP64
ja thermal resistance
junction-to-ambient
JEDEC (4.5 in  4 in)
0 m/s 58 C/W
1 m/s 51 C/W
2.5 m/s 47 C/W
8-layer (4.5 in  3 in)
0 m/s 81 C/W
1 m/s 66 C/W
2.5 m/s 60 C/W
T
j
T
amb
P
D
R
th j a–
+=