Datasheet

LPC11E3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 2.3 — 11 September 2014 66 of 71
NXP Semiconductors
LPC11E3x
32-bit ARM Cortex-M0 microcontroller
Fig 38. Reflow soldering for the LQFP64 package
SOT314-2
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP64 package
Ax
Bx
Gx
Gy
Hy
Hx
AyBy
P1P2
D2 (8×) D1
(0.125)
Ax Ay Bx By D1 D2 Gx Gy Hx Hy
13.300 13.300 10.300 10.300
P1
0.500
P2
0.560 0.280
C
1.500 0.400 10.500 10.500 13.550 13.550
sot314-2_fr
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout