Datasheet

LPC11E3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 2.3 — 11 September 2014 63 of 71
NXP Semiconductors
LPC11E3x
32-bit ARM Cortex-M0 microcontroller
13. Soldering
Fig 35. Reflow soldering for the HVQFN33 (5x5) package
Footprint information for reflow soldering of HVQFN33 package
occupied area
solder paste
solder land
Dimensions in mm
P
0.5
002aag766
Issue date
11-11-15
11-11-20
Ax Ay Bx C D
5.95 5.95 4.25 0.85
By
4.25 0.27
Gx
5.25
Gy
5.25
Hy
6.2
Hx
6.2
SLx SLy nSPx nSPy
3.75 3.75 3 3
0.30
0.60
detail X
C
SLy
D
SLx
Bx
Ay
P
nSPy
nSPx
see detail X
Gx
Hx
GyHy
By
Ax