Datasheet
Table Of Contents
- 1. General description
- 2. Features and benefits
- 3. Applications
- 4. Ordering information
- 5. Block diagram
- 6. Pinning information
- 7. Functional description
- 7.1 ARM Cortex-M0 processor
- 7.2 On-chip flash program memory
- 7.3 On-chip SRAM
- 7.4 Memory map
- 7.5 Nested Vectored Interrupt Controller (NVIC)
- 7.6 IOCONFIG block
- 7.7 Fast general purpose parallel I/O
- 7.8 UART
- 7.9 SPI serial I/O controller
- 7.10 I2C-bus serial I/O controller
- 7.11 C_CAN controller
- 7.12 10-bit ADC
- 7.13 General purpose external event counter/timers
- 7.14 System tick timer
- 7.15 Watchdog timer
- 7.16 Clocking and power control
- 7.17 System control
- 7.18 Emulation and debugging
- 8. Limiting values
- 9. Static characteristics
- 10. Dynamic characteristics
- 11. Application information
- 12. Package outline
- 13. Soldering
- 14. Abbreviations
- 15. Revision history
- 16. Legal information
- 17. Contact information
- 18. Contents

LPC11CX2_CX4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3.1 — 15 May 2013 55 of 62
NXP Semiconductors
LPC11Cx2/Cx4
32-bit ARM Cortex-M0 microcontroller
12. Package outline
Fig 29. Package outline SOT313-2 (LQFP48)
UNIT
A
max.
A
1
A
2
A
3
b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
7.1
6.9
0.5
9.15
8.85
0.95
0.55
7
0
o
o
0.12 0.10.21
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT313-2 MS-026136E05
00-01-19
03-02-25
D
(1) (1)(1)
7.1
6.9
H
D
9.15
8.85
E
Z
0.95
0.55
D
b
p
e
E
B
12
D
H
b
p
E
H
v M
B
D
Z
D
A
Z
E
e
v M
A
1
48
37
36
25
24
13
θ
A
1
A
L
p
detail X
L
(A )
3
A
2
X
y
c
w M
w M
0 2.5 5 mm
scale
pin 1 index
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2