Datasheet

LPC11CX2_CX4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3.1 — 15 May 2013 28 of 62
NXP Semiconductors
LPC11Cx2/Cx4
32-bit ARM Cortex-M0 microcontroller
8. Limiting values
[1] The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless
otherwise noted.
[2] Maximum/minimum voltage above the maximum operating voltage (see Table 6
) and below ground that can be applied for a short time
(<10 ms) to a device without leading to irrecoverable failure. Failure includes the loss of reliability and shorter lifetime of the device.
[3] Including voltage on outputs in 3-state mode.
[4] The peak current is limited to 25 times the corresponding maximum current.
[5] The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined
based on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details.
[6] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
Symbol Parameter Conditions Min Max Unit
V
DD
supply voltage (core
and external rail)
on pins V
DD
[2]
0.5 4.6 V
V
I
input voltage 5 V tolerant I/O pins; only valid when the V
DD
supply
voltage is present
[3]
0.5 +5.5 V
V
x
voltage on pin x no time limit; DC value
on pins CANH and CANL 58 +58 V
on pins STB, V
CC
, VDD_CAN 0.3 +7 V
I
DD
supply current per supply pin
[4]
-100mA
I
SS
ground current per ground pin
[4]
-100mA
I
latch
I/O latch-up current (0.5V
DD
) < V
I
< (1.5V
DD
);
T
j
< 125 C
-100mA
T
stg
storage temperature non-operating
[5]
65 +150 C
T
j(max)
maximum junction
temperature
-150C
P
tot(pack)
total power dissipation
(per package)
based on package heat transfer, not device power
consumption
-1.5W
V
ESD
electrostatic discharge
voltage
human body model;
all pins except CAN on-chip transceiver pins CANL,
CANH, STB, VDD_CAN, V
CC
, GND on
LPC11C22/C24
[6]
6500 +6500 V
pins CANH and CANL on LPC11C22/C24
[6]
8000 +8000 V
pins STB, VDD_CAN, V
CC
, GND on
LPC11C22/C24
[6]
4000 +4000 V