Datasheet

LPC111X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 9.2 — 26 March 2014 59 of 127
NXP Semiconductors
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
9. Thermal characteristics
The average chip junction temperature, T
j
(C), can be calculated using the following
equation:
(1)
• T
amb
= ambient temperature (C),
• R
th(j-a)
= the package junction-to-ambient thermal resistance (C/W)
• P
D
= sum of internal and I/O power dissipation
The internal power dissipation is the product of I
DD
and V
DD
. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
j
T
amb
P
D
R
th j a–
+=
Table 13. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
T
j(max)
maximum junction
temperature
--125 C
Table 14. LPC111x/x01 Thermal resistance value (C/W): ±15 %
HVQFN33 LQFP48
ja ja
JEDEC (4.5 in  4 in) JEDEC (4.5 in  4 in)
0 m/s 40.4 0 m/s 82.1
1 m/s 32.7 1 m/s 73.7
2.5 m/s 28.3 2.5 m/s 68.2
Single-layer (4.5 in  3 in) 8-layer (4.5 in  3 in)
0 m/s 84.8 0 m/s 115.2
1 m/s 61.6 1 m/s 94.7
2.5 m/s 53.1 2.5 m/s 86.3
jc 20.3 jc 29.6
jb 1.1 jb 34.2