Datasheet

LPC111X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 9.2 — 26 March 2014 3 of 127
NXP Semiconductors
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
 LPC1100L series available as TSSOP28 package, DIP28 package, TSSOP20
package, and SO20 package.
 Extended temperature (40 C to +105 C) for selected parts (see Table 2
).
3. Applications
4. Ordering information
 eMetering  Lighting
 Alarm systems  White goods
Table 1. Ordering information
Type number Package
Name Description Version
SO20, TSSOP20, TSSOP28, and DIP28 packages
LPC1110FD20 SO20 SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
LPC1111FDH20/002 TSSOP20 TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
SOT360-1
LPC1112FD20/102 SO20 SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
LPC1112FDH20/102 TSSOP20 TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
SOT360-1
LPC1112FDH28/102 TSSOP28 TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
SOT361-1
LPC1114FDH28/102 TSSOP28 TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
SOT361-1
LPC1114FN28/102 DIP28 DIP28: plastic dual in-line package; 28 leads (600 mil) SOT117-1
HVQFN24/33, LQFP48, and TFBGA48 packages
LPC1111FHN33/101 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1111FHN33/102 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1111FHN33/201 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1111FHN33/202 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1111FHN33/103 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1111JHN33/103 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1111FHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1111JHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1112FHN33/101 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1112FHN33/102 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a