Datasheet

LPC111X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 9.2 — 26 March 2014 115 of 127
NXP Semiconductors
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
Fig 66. Reflow soldering of the HVQFN24 package
SOT616-3Footprint information for reflow soldering of HVQFN24 package
Dimensions in mm
Ax Ay Bx By D SLx SLy SPx tot SPy tot SPx SPy Gx Gy Hx Hy
5.000 5.000 3.200 3.200
P
0.500 0.240
C
0.900 2.500 2.500 1.500 1.500 0.550 0.550 4.300 4.300 5.250 5.250
nSPx nSPy
22
sot616-3_fr
occupied area
Ax
Bx
SLx
Gx
Gy
Hy
Hx
AyBySLy
P 0.025
0.025
D
(0.105)
SPx tot
SPy tot
nSPx
nSPy
SPx
SPy
solder land plus solder paste
solder land
solder paste deposit
C
Generic footprint pattern
Refer to the package outline drawing for actual layout
Issue date
07-05-07
09-06-15