Datasheet

LPC111X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 9.2 — 26 March 2014 108 of 127
NXP Semiconductors
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
Fig 59. Package outline (HVQFN33 7x7)
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
- - -
hvqfn33_po
09-03-17
09-03-23
Unit
mm
max
nom
min
1.00
0.85
0.80
0.05
0.02
0.00
0.2
7.1
7.0
6.9
4.85
4.70
4.55
7.1
7.0
6.9
0.65 4.55
0.75
0.60
0.45
0.1
A
(1)
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 x 7 x 0.85 mm
A
1
b
0.35
0.28
0.23
cD
(1)
D
h
E
(1)
E
h
4.85
4.70
4.55
ee
1
e
2
4.55
Lv
0.1
w
0.05
y
0.08
y
1
0 2.5 5 mm
scale
terminal 1
index area
B
A
D
E
C
y
C
y
1
X
detail X
A
1
A
c
b
e
2
e
1
e
e
AC
B
v
Cw
terminal 1
index area
D
h
E
h
L
9 16
32
33
25
17
24
8
1