Datasheet

LPC111X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 9.2 — 26 March 2014 107 of 127
NXP Semiconductors
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
Fig 58. Package outline (HVQFN33 5x5)
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
MO-220
hvqfn33f_po
11-10-11
11-10-17
Unit
(1)
mm
max
nom
min
0.85
0.05
0.00
0.2
5.1
4.9
3.75
3.45
5.1
4.9
3.75
3.45
0.5 3.5
A
1
Dimensions (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
bc
0.30
0.18
D
(1)
A
(1)
D
h
E
(1)
E
h
ee
1
e
2
L
3.5
vw
0.1 0.1
y
0.05
0.5
0.3
y
1
0.05
0 2.5 5 mm
scale
1/2 e
AC
B
v
Cw
terminal 1
index area
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
916
32 25
24
17
8
1
X
D
E
C
B
A
e
2
terminal 1
index area
1/2 e