Datasheet

56F826 Technical Data, Rev. 14
50 Freescale Semiconductor
Figure 4-2 100-pin LQPF Mechanical Information
Please see www.freescale.com for the most current case outline.
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -AB- IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED
AT DATUM PLANE -AB-.
5. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE -AC-.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT
DATUM PLANE -AB-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014). DAMBAR CAN NOT BE LOCATED
ON THE LOWER RADIUS OR THE FOOT.
MINIMUM SPACE BETWEEN PROTRUSION
AND AN ADJACENT LEAD IS 0.070 (0.003).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
AE
AE
AD
SEATING
(24X PER SIDE)
R
GAUGE PLANE
DETAIL AD
SECTION AE-AE
S
V
B
A
96X
X
E
C
K
H
W
D
F
J
N
9
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 13.950 14.050 0.549 0.553
B 13.950 14.050 0.549 0.553
C 1.400 1.600 0.055 0.063
D 0.170 0.270 0.007 0.011
E 1.350 1.450 0.053 0.057
F 0.170 0.230 0.007 0.009
G 0.500 BSC 0.020 BSC
H 0.050 0.150 0.002 0.006
J 0.090 0.200 0.004 0.008
K 0.500 0.700 0.020 0.028
M 12 REF 12 REF
N 0.090 0.160 0.004 0.006
Q 1 5 1 5
R 0.150 0.250 0.006 0.010
S 15.950 16.050 0.628 0.632
V 15.950 16.050 0.628 0.632
W 0.200 REF 0.008 REF
X 1.000 REF 0.039 REF
°°
°°°°
CASE 842F-01
-T-
S
T-U
S
0.15(0.006) Z
S
AC
S
T-U
S
0.15(0.006) Z
S
AC
S
T-U
S
0.15(0.006) Z
S
AC
-U-
S
T-U
S
0.15(0.006) Z
S
AB
-Z-
-AC-
G
PLANE
-AB-
S
T-U
M
0.20(0.008) Z
S
AC
0.100(0.004)
AC
Q
°
M
°
0.25 (0.010)