Datasheet

56F801 Technical Data, Rev. 17
42 Freescale Semiconductor
Figure 4-2 48-pin LQFP Mechanical Information
Please see www.freescale.com for the most current case outline.
A
A1
Z
0.200 AB T-U
4X
Z0.200 AC T-U
4X
B
B1
1
12
13
24
25
36
37
48
S1
S
V
V1
P
AE AE
T, U, Z
DETAIL Y
DETAIL Y
BASE METAL
N
J
F
D
T-U
M
0.080 ZAC
SECTION AE-AE
AD
G
0.080 AC
M
°
TOP & BOTTOM
L
°
W
K
AA
E
C
H
0.250
R
9
DETAIL AD
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
4. DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
5. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE AC.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE AB.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION
SHALL NOT CAUSE THE D DIMENSION TO
EXCEED 0.350.
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076.
9. EXACT SHAPE OF EACH CORNER IS
OPTIONAL.
CASE 932-03
ISSUE F
T
U
Z
AB
AC
GAUGE PLANE
DIM
A
MIN MAX
7.000 BSC
MILLIMETERS
A1 3.500 BSC
B 7.000 BSC
B1 3.500 BSC
C 1.400 1.600
D 0.170 0.270
E 1.350 1.450
F 0.170 0.230
G 0.500 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
M 12 REF
N 0.090 0.160
P 0.250 BSC
L 0 7
R 0.150 0.250
S 9.000 BSC
S1 4.500 BSC
V 9.000 BSC
V1 4.500 BSC
W 0.200 REF
AA 1.000 REF
°
°°