Datasheet

DAC1405D750 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 31 January 2012 37 of 43
NXP Semiconductors
DAC1405D750
Dual 14-bit DAC, up to 750 Msps; 4 and 8 interpolating
11. Package outline
Fig 20. Package outline SOT638-1 (HTQFP100)
UNIT
A
max.
A
1
A
2
A
3
b
p
H
D
H
E
L
p
Z
D
(1)
Z
E
(1)
ceLywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
1.2
0.15
0.05
1.05
0.95
0.25
0.27
0.17
0.20
0.09
14.1
13.9
0.5
16.15
15.85
1.15
0.85
7°
0°
0.08 0.080.21
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT638-1 MS-026
03-04-07
05-02-02
D
(1)
E
(1)
14.1
13.9
16.15
15.85
D
h
E
h
7.1
6.1
7.1
6.1
1.15
0.85
b
p
b
p
e
θ
E
A
1
A
L
p
detail X
L
(A
3
)
B
25
H
D
H
E
A
2
v M
B
D
Z
D
A
c
Z
E
e
v M
A
X
1
100
76
75 51
50
26
y
pin 1 index
w M
w M
0 10 mm
scale
HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads;
body 14 x 14 x 1 mm; exposed die pad
SOT638-1
D
h
E
h
exposed die pad side