Datasheet

1998 Jul 06 6
NXP Semiconductors Product specification
UHF power transistor BFG21W
Fig.5 Printed-circuit board and component lay-out for 1.9 GHz class-AB test-circuit in Fig.4.
Dimensions in mm.
The components are situated on one side of the copper-clad PTFE fibre-glass board, the other side is unetched and serves as a ground plane.
Earth connections from the component side to the ground plane are made by through metallization.
handbook, full pagewidth
MGM222
45
35
C4
C6
C7R3
R2
R1
TR1
C5
L3
L4
L5
output
C2
L1
L2
input
C1
C3
DUT
V
C
V
S