Datasheet

BCV63_63B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 4 — 4 August 2010 8 of 12
NXP Semiconductors
BCV63; BCV63B
NPN general-purpose double transistors
12. Soldering
Fig 7. Reflow soldering footprint SOT143B
Fig 8. Wave soldering footprint SOT143B
solder lands
solder resist
occupied area
solder paste
sot143b_fr
0.9
0.60.7
3.25
3
0.6
(3×)
0.6
(3×)
0.5
(3×)
0.7
(3×)
1
1.9
2
0.75 0.95
Dimensions in mm
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot143b_fw
4.6
4.45
1.2
(3×)
1.425
(3×)
1.425
1
1.2
2.2
2.575
Dimensions in mm