Datasheet

BC848_SER_7 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 07 — 17 November 2009 7 of 12
NXP Semiconductors
BC848 series
30 V, 100 mA NPN general-purpose transistors
10. Soldering
Dimensions in mm
Fig 7. Reflow soldering footprint SOT23 (TO-236AB)
Dimensions in mm
Fig 8. Wave soldering footprint SOT23 (TO-236AB)
MSA439
1.00
0.60
(3x)
1.30
12
3
2.50
3.00
0.85
2.70
2.90
0.50 (3x)
0.60 (3x)
3.30
0.85
solder lands
solder resist
occupied area
solder paste
MSA427
4.00
4.60
2.80
4.50
1.20
3.40
3
21
1.20 (2x)
preferred transport direction during soldering
solder lands
solder resist
occupied area