User Guide

© NXP Laboratories UK 2012 JN-DS-JN5168-001-Myy 1v1 19
Figure 11: Peak Field Strengths for various modules optimised for height and azimuth
A.5 Manufacturing
A.5.1 Reflow Profile
For reflow soldering, it is recommended to follow the reflow profile in figure 6 as a guide, as well as the paste
manufacturer‟s guidelines on peak flow temperature, soak times, time above liquid and ramp rates.
Figure 12: Recommended solder reflow profile
98.0
98.5
99.0
99.5
100.0
100.5
101.0
101.5
102.0
102.5
103.0
103.5
104.0
11
18
26
dBuV/m @ 3m
Channel
Module Peak Field Strengths
JN5168-001-M03 with
vertical
JN5168-001-M00
JN5148-001-M00
Temperature
25~160 ºC
160~190 ºC
> 220º C
230~Pk.
Pk. Temp
(235ºC)
Target Time (s)
90~130
30~60
20~50
10~15
150~270