User Manual

ManualsBrandsNXP Laboratories UK ManualsAudio EquipmentIEEE 802.15.4 Wireless Microcontroller

Table Of Contents

1 Introduction
- 1.1 Wireless Transceiver
- 1.2 RISC CPU and Memory
- 1.3 Peripherals
- 1.4 Block Diagram
2 Pin Configurations
- 2.1 Pin Assignment
- 2.2 Pin Descriptions
3 CPU
4 Memory Organisation
- 4.1 ROM
- 4.2 RAM
- 4.3 OTP eFuse Memory
- 4.4 External Memory
  - 4.4.1 External Memory Encryption
- 4.5 Peripherals
- 4.6 Unused Memory Addresses
5 System Clocks
- 5.1 16MHz System Clock
  - 5.1.1 32MHz Oscillator
  - 5.1.2 24MHz RC Oscillator
- 5.2 32kHz System Clock
6 Reset
- 6.1 Internal Power-on Reset
- 6.2 External Reset
- 6.3 Software Reset
- 6.4 Brown-out Detect
- 6.5 Watchdog Timer
7 Interrupt System
- 7.1 System Calls
- 7.2 Processor Exceptions
- 7.3 Hardware Interrupts
8 Wireless Transceiver
- 8.1 Radio
  - 8.1.1 Radio External Components
  - 8.1.2 Antenna Diversity
- 8.2 Modem
- 8.3 Baseband Processor
- 8.4 Security Coprocessor
- 8.5 Location Awareness
- 8.6 Higher Data Rates
9 Digital Input/Output
10 Serial Peripheral Interface
11 Timers
- 11.1 Peripheral Timer/Counters
- 11.2 Tick Timer
- 11.3 Wakeup Timers
  - 11.3.1 RC Oscillator Calibration
12 Pulse Counters
13 Serial Communications
- 13.1 Interrupts
- 13.2 UART Application
14 JTAG Debug Interface
15 Two-Wire Serial Interface
- 15.1 Connecting Devices
- 15.2 Clock Stretching
- 15.3 Master Two-wire Serial Interface
- 15.4 Slave Two-wire Serial Interface
16 Four-Wire Digital Audio Interface
17 Random Number Generator
18 Sample FIFO
19 Intelligent Peripheral Interface
- 19.1 Data Transfer Format
- 19.2 JN5148 (Slave) Initiated Data Transfer
- 19.3 Remote (Master) Processor Initiated Data Transfer
20 Analogue Peripherals
- 20.1 Analogue to Digital Converter
- 20.2 Digital to Analogue Converter
  - 20.2.1 Operation
- 20.3 Comparators
21 Power Management and Sleep Modes
- 21.1 Operating Modes
  - 21.1.1 Power Domains
- 21.2 Active Processing Mode
  - 21.2.1 CPU Doze
- 21.3 Sleep Mode
- 21.4 Deep Sleep Mode
22 Electrical Characteristics
- 22.1 Maximum Ratings
- 22.2 DC Electrical Characteristics
- 22.3 AC Characteristics
Appendix A Mechanical and Ordering Information
- A.1 56-pin QFN Package Drawing
- A.2 PCB Decal
- A.3 Ordering Information
- A.4 Device Package Marking
- A.5 Tape and Reel Information
Appendix B Development Support
- B.1 Crystal Oscillators
- B.2 32MHz Oscillator
- B.3 32kHz Oscillator
- B.4 JN5148 Module Reference Designs
  - B.4.1 Schematic Diagram
  - B.4.2 PCB Design and Reflow Profile
- Related Documents
- RoHS Compliance
- Status Information
- Disclaimers
- Version Control
- Contact Details

Jennic

94 JN-DS-JN5148-001 1v2 © Jennic 2009

Preliminary

B.4.2 PCB Design and Reflow Profile

PCB and land pattern designs are key to the reliability of any electronic circuit design.

The Institute for Interconnecting and Packaging Electronic Circuits (IPC) defines a number of standards for electronic

devices. One of these is the "Surface Mount Design and Land Pattern Standard" IPC-SM-782

[4], commonly referred

to as “IPC782". This specification defines the physical packaging characteristics and land patterns for a range of

surface mounted devices. IPC782 is also a useful reference document for general surface mount design techniques,

containing sections on design requirements, reliability and testability. Jennic strongly recommends that this be

referred to when designing the PCB.

The suggested reflow profile is shown in

Figure 56. The specific paste manufacturers guidelines on peak flow

temperature, soak times, time above liquidus and ramp rates should also be referenced.

Figure 56: Recommended Reflow Profile for Lead-free Solder Paste or PPF lead frame