User Manual

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Table Of Contents

1 Introduction
- 1.1 Wireless Transceiver
- 1.2 RISC CPU and Memory
- 1.3 Peripherals
- 1.4 Block Diagram
2 Pin Configurations
- 2.1 Pin Assignment
- 2.2 Pin Descriptions
3 CPU
4 Memory Organisation
- 4.1 ROM
- 4.2 RAM
- 4.3 OTP eFuse Memory
- 4.4 External Memory
  - 4.4.1 External Memory Encryption
- 4.5 Peripherals
- 4.6 Unused Memory Addresses
5 System Clocks
- 5.1 16MHz System Clock
  - 5.1.1 32MHz Oscillator
  - 5.1.2 24MHz RC Oscillator
- 5.2 32kHz System Clock
6 Reset
- 6.1 Internal Power-on Reset
- 6.2 External Reset
- 6.3 Software Reset
- 6.4 Brown-out Detect
- 6.5 Watchdog Timer
7 Interrupt System
- 7.1 System Calls
- 7.2 Processor Exceptions
- 7.3 Hardware Interrupts
8 Wireless Transceiver
- 8.1 Radio
  - 8.1.1 Radio External Components
  - 8.1.2 Antenna Diversity
- 8.2 Modem
- 8.3 Baseband Processor
- 8.4 Security Coprocessor
- 8.5 Location Awareness
- 8.6 Higher Data Rates
9 Digital Input/Output
10 Serial Peripheral Interface
11 Timers
- 11.1 Peripheral Timer/Counters
- 11.2 Tick Timer
- 11.3 Wakeup Timers
  - 11.3.1 RC Oscillator Calibration
12 Pulse Counters
13 Serial Communications
- 13.1 Interrupts
- 13.2 UART Application
14 JTAG Debug Interface
15 Two-Wire Serial Interface
- 15.1 Connecting Devices
- 15.2 Clock Stretching
- 15.3 Master Two-wire Serial Interface
- 15.4 Slave Two-wire Serial Interface
16 Four-Wire Digital Audio Interface
17 Random Number Generator
18 Sample FIFO
19 Intelligent Peripheral Interface
- 19.1 Data Transfer Format
- 19.2 JN5148 (Slave) Initiated Data Transfer
- 19.3 Remote (Master) Processor Initiated Data Transfer
20 Analogue Peripherals
- 20.1 Analogue to Digital Converter
- 20.2 Digital to Analogue Converter
  - 20.2.1 Operation
- 20.3 Comparators
21 Power Management and Sleep Modes
- 21.1 Operating Modes
  - 21.1.1 Power Domains
- 21.2 Active Processing Mode
  - 21.2.1 CPU Doze
- 21.3 Sleep Mode
- 21.4 Deep Sleep Mode
22 Electrical Characteristics
- 22.1 Maximum Ratings
- 22.2 DC Electrical Characteristics
- 22.3 AC Characteristics
Appendix A Mechanical and Ordering Information
- A.1 56-pin QFN Package Drawing
- A.2 PCB Decal
- A.3 Ordering Information
- A.4 Device Package Marking
- A.5 Tape and Reel Information
Appendix B Development Support
- B.1 Crystal Oscillators
- B.2 32MHz Oscillator
- B.3 32kHz Oscillator
- B.4 JN5148 Module Reference Designs
  - B.4.1 Schematic Diagram
  - B.4.2 PCB Design and Reflow Profile
- Related Documents
- RoHS Compliance
- Status Information
- Disclaimers
- Version Control
- Contact Details

Jennic

Preliminary

As is stated above, not all combinations of crystal load capacitance and ESR are valid, and as explained in Appendix

B.1.3 there is a trade-off that exists between the load capacitance and crystal ESR to achieve reliable performance.

For this reason, we recommend that for a 9pF load capacitance crystals be specified with a maximum ESR of 40

ohms. For lower load capacitances the recommended maximum ESR rises, for example, CL=7pF the max ESR is 61

ohms. For the lower cost crystals in the large HC49 package, a load capacitance of 9 or 10pF is widely available and

the max ESR of 30 ohms specified by many manufacturers is acceptable. Also available in this package style, are

crystals with a load capacitance of 12pF, but in this case the max ESR required is 25 ohms or better.

Below is measurement data showing the variation of the crystal oscillator amplifier transconductance with

temperature and supply voltage, notice how small the variation is. Circuit techniques have been used to apply

compensation, such that the user need only design for nominal conditions.

32MHz Crystal Oscillator

4.1

4.15

4.2

4.25

4.3

4.35

-40 -20 0 20 40 60 80 100

Temperature (C)

Transconductance (mA/V)

32MHz Crystal Oscillator

4.28

4.29

4.3

4.31

2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6

Supply Voltage (VDD)

Transconductance (mA/V)