Data Sheet

© NXP Laboratories UK 2012 JN-DS-JN5142-x01-Myy 1v0 13
A.3 Manufacturing
A.3.1 Reflow Profile
For reflow soldering, it is recommended to follow the reflow profile in figure 6 as a guide, as well as the paste
manufacturers guidelines on peak flow temperature, soak times, time above liquidus and ramp rates.
Figure 5: Recommended solder reflow profile
A.3.2 Soldering Paste and Cleaning
NXP would not recommend use of a solder paste that requires the module and pcb assembly to be cleaned (rinsed in
water) for the following reasons:
Solder flux residues and water can be trapped by the pcb, can or components and result in short circuits.
The module label could be damaged or removed.
NXP recommends use of a 'no clean' solder paste for all its module products.
Temperature
25~160 ºC
160~190 ºC
> 220º C
230~Pk.
Pk. Temp
(235ºC)
Target Time (s)
90~130
30~60
20~50
10~15
150~270