User Manual

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70 JN-DS-JN5139 v1.5 © Jennic 2008
A.6 PCB Design and Reflow Profile
PCB and land pattern designs are key to board level reliability, and Jennic strongly recommends that users follow the
design rules listed in IPC-SM-782. For reflow profiles, it is recommended to follow the reflow profile in Figure 48 as a
guide, as well as the paste manufacturers guidelines on peak flow temperature, soak times, time above liquidus and
ramp rates.
Figure 48: Reflow Profile