User Manual

Jennic

JennicJennic

Jennic

5. Electrical Characteristics

In most cases, the Electrical Characteristics are the same for both module and chip. They are described in detail in

the chip datasheet. Where there are differences, they are detailed below.

5.1. Maximum Ratings

Exceeding these conditions will result in damage to the device.

Parameter Min Max

Device supply voltage VDD -0.3V 3.6V

Voltage on analogue pins: ADC1-4, DAC1-2, COMP1-,

COMP1+, COMP2-, COMP2+, DIO9, DIO10, SPISSM,

SPISWP, SPICLK, SPIMOSI, SPIMISO,

-0.3V VDD + 0.3V

Voltage on 5v tolerant digital pins: SPISSZ, DIO0-

DIO8, DIO11-DIO20, RESETN

-0.3V Lower of (VDD + 2V)

and 5.5V

Storage temperature -40ºC 150ºC

Reflow soldering temperature according to IPC/JEDEC

J-STD-020C

260ºC

This device is sensitive to ESD and should only be handled using ESD precautions.

5.2. Reflow Profile

For reflow soldering, it is recommended to follow the reflow profile in Figure 2 as a guide, as well as the paste

manufacturers guidelines on peak flow temperature, soak times, time above liquidus and ramp rates.

Figure 2: Recommended solder reflow profile

Temperature 25~160 ºC 160~190 ºC > 220º C 230~Pk. Pk. Temp

(235ºC)

Target Time (s) 90~130 30~60 20~50 10~15 160~270