Datasheet

10.3
Backplanes
Part number in bold face type: ready for despatch within 2 working days
Part number in normal type: ready for despatch within 10 working days
Main Catalogue
E 03/2009
Solder paste printing
Automatic optical inspection (AOI)
Connector mounting
Conformal coating
Electrical final test
Modern machine facilities in Straubenhardt
Solder paste printing is one of the quality-defining process steps
in backplane manufacture. This solder-paste printer, based on
innovative inkjet technology, allows fast, flexible and highly
dependable solder paste printing. Since the process dispenses
with the ’stencils’ required by other methods, the printing program
can be changed in a very short time. This means that small
batches can also be printed cost-effectively.
Our modern SMD placement machines support a wide spectrum
of components with a high placement performance. Small and
large production runs can be implemented flexibly and time-
efficiently.
Vapour-phase soldering, also known as vapour-phase reflow,
is currently the most universal and most reliable soldering process.
It is ideally suited to all types of SMD component and carrier
material. The homogenous temperature distribution of the carrier
medium allows the widest variety of sub-assemblies, from
Flexprints to multilayer boards, to be soldered reliably without
danger of overheating.
There is also the option of processing conventional components
with our wave-soldering system.
Automatic optical inspection (AOI) is an optical test procedure
for constructed sub-assemblies. Highly-developed image
processing systems reliably detect faulty soldered joints and
wrongly placed or missing components.
Connectors are pressed into the backplane fully automatically.
The press-in technique allows quick and economic mounting
of the connector without subjecting the PCB to thermal stress.
The press-in action creates a gas-tight, dependably electrically
conductive and mechanically strong connection. Intelligent force/
displacement measuring during the press-in action ensures
consistent high quality.
Backplanes that are subject to particular climatic stresses can be
coated with a protective lacquer (conformal coating). This
coating protects the backplane from e.g. corrosion and mould.
The fluorescent characteristic of the protective coating enables the
coating to be checked for completeness or damage under UV light.
No backplane leaves our production facility without 100% testing.
All backplanes are subjected to extensive electrical testing before
despatch. An automatic process checks the entire backplane for
continuity and short circuits. This testing also covers passive and
simple active components such as resistors, capacitors and diodes
and the description and testing of I2C EEPROMS or bus
terminations. For this Schroff has a comprehensive automated
and semi-automated testing facility.
Our competence in overview
Buch Backplane.book Seite 3 Donnerstag, 23. April 2009 11:43 23