Datasheet

Dimensional drawing
➀ Encapsulation: molded epoxy resin
➁ NiFe; tinned surface Sn100 or gold-plated
➂ Reduced slot length for case size A
Dimensions
Case size Dimensions in mm (inches)
EPCOS EIA/IECQ L W H L
2
typ. W
2
±0.1 H
2
typ. P ±0.3
±(.004) ±(.012)
A 3216-18 3.2 ±0.2 1.6 ±0.2 1.6 ±0.2 3.2 1.2 1.3 0.8
(.126
±0.008)
(.063
±0.008)
(.063
±0.008)
(.126) (.047) (.051) (.031)
B 3528-21 3.5 ±0.2 2.8 ±0.2 1.9 ±0.2 3.5 2.2 1.4 0.7
(.138
±0.008)
(.110
±0.008)
(.075
±0.008)
(.138) (.087) (.055) (.027)
C 6032-28 6.0 ±0.3 3.2 ±0.3 2.5 ±0.3 6.1 2.2 1.8 1.3
(.236
±0.012)
(.126
±0.012)
(.098
±0.012)
(.240) (.087) (.071) (.051)
D 7343-31 7.3 ±0.3 4.3 ±0.3 2.8 ±0.3 7.3 2.4 1.8 1.3
(.287
±0.012
(.169
±0.012)
(.110
±0.012)
(.287) (.094) (.071) (.051)
E 7343-44 7.3 ±0.3 4.3 ±0.3 4.1 ±0.3 7.3 2.4 1.8 1.3
(.287
±0.012
(.169
±0.012)
(.161
±0.012)
(.287) (.094) (.071) (.051)
Tantalum chip capacitors B45196E, B45198E, B45196H, B45198H
Standard / HighCap
Page 3 of 20Please read Cautions and warnings and
Important notes at the end of this document.