Integration Guide

GEM3 Module Hardware Integration Guide Version 0.1
North Pole Engineering
221 N 1st St, Minneapolis, MN 55401
www.npe-inc.com
612.305.0440
2. Good: Define a copper keepout area approx. 53mm x 20mm, 6mm in from module edge.
Better: Increase the keepout area, starting at 6mm in from module edge.
3. Mechanical items (especially metal) should be kept as far as possible from the module
antenna in all directions, including above and below the board surface. If possible, move
mechanical items out and away from the keepout area.
4. Bottom layer ground plane under the module strongly recommended. Connect all ground
pins directly to ground plane.
5. Top layer ground plane is good to have wherever practical, but avoid having copper directly
under the module.
6. Place Via stitching where both top and bottom layer ground planes are used, especially along
the plane edges adjacent the module. 
Top-side area directly under the module should be kept clear of copper, silkscreen and vias