Owner's manual

1-2 Introduction
1.4 Training
To optimize the full capabilities and features of your dispensing system, Nordson ASYMTEK
recommends that customer technicians, or engineers responsible for supporting the dispensing system and
software become certified.
Nordson ASYMTEK offers four levels of training courses to enable customer technicians/engineers to
become fully certified in dispensing system safety, operation, hardware, software, and fluid applications.
For more information on training courses and details on full certification, contact Nordson ASYMTEK
Technical Support or your Customer Service representative.
 NOTE Find your local Technical Support and Customer Service contacts on the Nordson
ASYMTEK web site, www.nordsonasymtek.com
. Click on Tech Support or Contact
Us
(sales/customer support).
1.5 Typical Dispensing Applications
Nordson ASYMTEK dispensing systems using FmXP can be used for a wide variety of applications.
Table 1-1 and Figure 1-1 describe typical dispensing applications supported by FmXP software.
Table 1-1 Typical Dispensing Applications
Application Description
Dam and Fill
A Dam is a physical barrier laid down to contain material within a specified
area, or outside of another area. Fill refers to the adhesive epoxy that is
contained within the dam.
Die Attach
Die Attach is the process of attaching die in to a board. It is commonly used
for Chip-on-Board (COB), Printed Circuit Board (PCB) and Multi-Chip Module
(MCM) applications.
Selective Flux
Selective Flux refers to the flux dispensed on surfaces that will be attached to
solder. Flux holds the solder heat more uniformly, which enables the solder to
adhere better to the surfaces.
Solder Mask
Solder Mask is used to prevent solder from reaching specific contact points
on the PCB during the wave soldering process. Automating this process
improves quality because the mask pattern is applied consistently every time,
resulting in higher yields and less rework.
Solder Paste
Solder Paste is a conductive paste dispensed to hold components in place
on a PCB while permitting electrons to flow between the component and
the substrate.
Surface Mount
Technology
(SMT)
Surface Mount Adhesive (SMA) is an adhesive used for attaching chips to
PCBs. Generally, our system dispenses the epoxy onto the substrate and
another machine places a component on top of the epoxy.
Underfill
Underfill refers to the process of flowing epoxy underneath a flip chip on a
PCB to completely seal the solder interconnect bumps.