Manual

1-2 Introduction
Asymtek offers four levels of training courses to enable customer technicians/engineers to become fully
certified in dispensing system safety, operation, hardware, software, and fluid applications. For more
information on training courses and details on full certification, contact Asymtek Technical Support or
your Customer Service representative.
" NOTE Find your local Technical Support and Customer Service contacts on the
Asymtek web page, www.asymtek.com.
Click on Tech Support or Contact Us
(sales/customer support).
Typical Dispensing Applications
Asymtek offers dispensing systems for a wide variety of applications. Most complex dispensing systems
require software programs to control the dispensing system components. Basically, dispensing programs
instruct the dispensing system:
When to dispense the fluid
Where to dispense the fluid
How much fluid to dispense
Besides controlling the flow of the fluid, dispensing programs also control fluid temperature, dispensing
head motion, and maintenance functions such as purging.
Refer to Table 1-1 and Figure 1-1 for typical dispensing applications supported by FmNT.
Table 1-1 Typical Dispensing Applications
Application Description
Dam and Fill
A dam is a physical barrier laid down to contain material within a specified
area, or outside of another area. Fill refers to the adhesive epoxy that is
contained within the dam.
Die Attach
Die Attach is the process of attaching die in to a board. It is commonly
used for Chip-on-Board (COB), Printed Circuit Board (PCB) and Multi-
Chip Module (MCM) applications.
Selective Flux
Selective Flux refers to the flux dispensed on surfaces that will be
attached to solder. Flux holds the solder heat more uniformly, which
enables the solder to adhere better to the surfaces.
Solder Mask
Solder mask is used to prevent solder from reaching specific contact
points on the PCB during the wave soldering process. Automating this
process improves quality because the mask pattern is applied
consistently every time, resulting in higher yields and less rework.
Solder Paste
Solder Paste is a conductive paste dispensed to hold components in
place on a PCB while permitting electrons to flow between the component
and the substrate.
Surface Mount
Technology (SMT)
Surface Mount Adhesive (SMA) is an adhesive used for attaching chips to
PCBs. Generally, our system dispenses the epoxy onto the substrate
and another machine places a component on top of the epoxy.
Underfill
Underfill refers to the process of flowing epoxy underneath a flip chip on a
PCB to completely seal the solder interconnect bumps.