Manual

6-6 Beginning Programming
Rectangles
Rectangles are commonly used in Dam and Fill applications. A quick-drying, high-viscosity fluid is used
for the rectangle to form a perimeter dam. A lower viscosity adhesive is generally used for the fill. To
program a rectangle, you are required to teach the opposite corners.
Pots
Potting (Weight Control Dots) is a technique used to fill cavities or to dispense multi-height shapes.
Weight-Control dots can also be used by activating the Weight-Control feature and entering the desired
weight of the fluid to be dispensed. See “Dot Parameters” later in this section for instructions on
customizing dot parameters.
Area Fill
Area Fill dispensing is commonly used for Chip Encapsulation and Cavity Fill applications. It is
important for the fluid to cover the part completely without voids. Superior volumetric control delivers
accurate fill heights for consistent wire bond coverage and fill flatness.
Weight Control Lines
Weight-Control Lines are most commonly used in flip chip underfill applications. These are lines where
a defined amount (weight) of fluid is dispensed over a defined length of a line or pattern. They are more
accurate than ordinary lines. See “Line Parameters” later in this section for instructions on customizing
certain line parameters for greater control over specific characteristics of the line.
Find Substrate Height
This command inserts a Find Substrate Height procedure into your program. When FmNT performs a
Find Substrate Height procedure, it touches the substrate surface with the Height Sensor Probe, records
the Z-axis information, and uses the height information during dispensing.
Pattern
A pattern is a sequence of related instructions. As mentioned previously, a program can contain several
patterns. For example, you could include one pattern for dots and another for lines. The Pattern button
opens drop-down menu containing all Pattern-related functions.
Select Valve
This feature identifies which valve is affected by the current dispensing commands. It only applies to
systems equipped with a Dual-Action Dispensing Head.
Multipass
This feature is for applications that require multiple dispenses in the same location. It is commonly used
for Adhesion and Sealing applications that require a "seal run" after adhesion.