Instruction Manual

Glossary - 1
Glossary
area-fill: Dispensing lines of fluid
within a geometric pattern to completely
cover an area.
auer boat: A metal material handling
plate used to transport parts into
automated systems.
Automatic Fiducial Locating System:
A vision system that finds fiducials and
compensates for small changes on a
workpiece during dispensing.
Automove Control Language (ACL):
An Asymtek proprietary motion control
language consisting of commands that
control all components of the dispensing
system.
axis: X, Y or Z geometric dispensing
coordinates. See figure below.
beacon: A light pole generally mounted
on the top of the dispensing system which
can act as a visual indicator of system
status by displaying a different colored
light for all possible status conditions.
CAD: Stands for Computer Aided
Design.
camera offset: The calibration of the
XYZ location of the camera with the
crosshairs in the Vision System.
conveyor atom: A set of ACL
commands that controls the conveyor.
crosshairs: Two lines intersecting at a
90° angle in the center of the video
display on the computer monitor.
dispense head: The dispense head is
what moves during dispensing operation.
The valve, height sensor and similar
options attach to the dispense head.
dispense zone: The part of the
dispensing area where dispensing is
actually performed.
dispenser control panel: The front
control panel on most dispensing systems
that has buttons for controlling movement
of the dispense head.
dispensing fluid reservoir: The
reservoir contains the dispensing fluid. It
may be a syringe.
dispensing runs (wet/dry): The
execution of a dispensing program during
which fluid is dispensed (wet) or no fluid
is dispensed (dry).
download memory: Information
downloaded from one system to another.
electrostatic discharge (ESD): The
sudden transfer of electricity from one
object to another.
fiducial: A distinct shape or object on
the board or part to be dispensed upon.
The vision system uses these objects for
location reference.
flip chip: A die with solder bumps
which is placed die circuit side-down on a
PCB.
flip chip underfill: Dispensing lines of
fluid around the perimeter of a flip-chip
so that the fluid flows underneath the
chip.