User Manual

Glossary - 1
Glossary
area-fill: Dispensing lines of fluid
within a geometric pattern to
completely cover an area.
auer boat: A metal material handling
plate used to transport parts into
automated systems.
Automatic Fiducial Locating
System: A vision system that finds
fiducials and compensates for small
changes on a workpiece during
dispensing.
Automove Control Language
(ACL): An Asymtek proprietary
motion control language consisting of
commands that control all components
of the dispensing system.
axis: X, Y or Z geometric dispensing
coordinates. See figure below.
beacon: A light pole generally
mounted on the top of the dispensing
system which can act as a visual
indicator of system status by
displaying a different colored light for
all possible status conditions.
CAD: Stands for Computer Aided
Design.
camera offset: The calibration of the
XYZ location of the camera with the
crosshairs in the Vision System.
conveyor atom: A set of ACL
commands that controls the conveyor.
crosshairs: Two lines intersecting at
a 90° angle in the center of the video
display on the computer monitor.
dispense head: The dispense head is
what moves during dispensing
operation. The valve, height sensor
and similar options attach to the
dispense head.
dispense zone: The part of the
dispensing area where dispensing is
actually performed.
dispenser control panel: The front
control panel on most dispensing
systems that has buttons for
controlling movement of the dispense
head.
dispensing fluid reservoir: The
reservoir contains the dispensing fluid.
It may be a syringe.
dispensing runs (wet/dry): The
execution of a dispensing program
during which fluid is dispensed (wet)
or no fluid is dispensed (dry).
download memory: Information
downloaded from one system to
another.
electrostatic discharge (ESD): The
sudden transfer of electricity from one
object to another.
fiducial: A distinct shape or object
on the board or part to be dispensed
upon. The vision system uses these
objects for location reference.
flip chip: A die with solder bumps
which is placed die circuit side-down
on a PCB.