Instruction Manual
1-2 Introduction
1.5 ECXP Overview
Easy Coat for Windows XP (ECXP) is Asymtek proprietary software for use in a Windows XP
environment, developed specifically for conformal coating applications. Before the dispensing process
can begin, the ECXP software must be installed and programmed to perform the necessary procedures.
ECXP controls both the dispensing head (robot) movements and the dispensing operation in the
conformal coating process. ECXP features include:
• An intuitive interface and user-friendly environment, allowing you to create conformal
coating programs within minutes.
• Easy-to-use integrated cut, copy, paste, and delete functions common in Windows
applications.
• Multiple coating instruction commands that can be edited at once, minimizing the time
required to make programming and pattern changes.
• Full production line integration, supported through a SMEMA compatible system interface
conveyor and data logging.
1.6 Conformal Coating
Conformal coating is a process in which a printed circuit board (PCB) is completely coated with a
material to protect it from damage caused by the following conditions:
•
Environment
•
Dendrite Growth
•
Vibration •
Moisture
•
Dirt
•
Solvent
Conformal coating is used in a variety of applications. These include:
• Aerospace and Military Applications
• Automotive Applications
• Commercial Applications (Appliances)
• Railroad and Traffic Control Applications
• Industrial Applications
• Value Added Applications
1.6.1 Conformal Coating Process
Application of conformal coating is a two-step process. Dispensing the conformal coating is the first step.
It is commonly dispensed in one of the following ways:
• Dip
• Brush
• Manual Spray
• Automated Selective Coating
Asymtek offers an automated solution to the conformal coating process by offering Automated Selective
Coating. Unlike other methods, Automated Selective Coating achieves high throughput, dispensing
consistency, and material savings with little or no masking. Asymtek Conformal Coating Systems are
listed in Table 1-1.