Manual
2-2 Introduction
Table 2-1 Century Series System Configurations
Model
C-702 C-708 C-708 AICE
Application
•
Die attach
•
Surface mount
adhesive
•
IC encapsulation
•
Solder paste
•
Gasket and electronic
module sealing
•
Die attach
•
Surface mount
adhesive
•
IC encapsulation
•
Solder paste
•
Gasket and electronic
module sealing
•
Die attach
•
surface mount
adhesive
•
IC encapsulation
•
solder paste
•
gasket and electronic
module sealing
•
underfill
Heating
Type
•
Needle Heater
(option)
•
Vacuum Heated
Tooling Plate (option)
•
Needle Heater
(option)
•
Vacuum Heated
Tooling Plate (option)
•
Vacuum Heated
Tooling Plate
•
Needle Heater
Valve Type
•
DV-01 – DV-09
•
DV-6000 (option)
•
Dual-Action
Dispensing Head
(option)
•
DV-01 – DV-09
•
DV-6000 (option)
•
Dual-Action
Dispensing Head
(option)
•
DV-01 – DV-09
•
DV-6000
•
DP-2000
•
Dual-Action
Dispensing Head
Dispensing
Area
305 x 305 mm
(12 x 12 in)
With Dual-ActionDispensing
Head: 210 x 284 mm
(8.3 x 11.2 in)
457 x 457 mm
(18 x 18 in)
With Dual-Action Dispensing
Head: 362 x 438 mm
(14.3 x 17.3 in)
457 x 356 mm
(18 x 14 in)
With Dual-Action Dispensing
Head: 356 x 277 mm
(14 x 10.9 in)