Owner manual
vi Table of Contents
3.4 Computer Control Panel Features ........................................................................ 3-14
3.5 Fluidmove Software .............................................................................................. 3-15
3.6 Vision System ....................................................................................................... 3-16
3.6.1 Vision System Components .................................................................................... 3-16
3.6.2 Adjusting Light Level and Color ............................................................................... 3-18
3.6.3 Lens Removal and Installation ................................................................................ 3-20
3.7 Height Sensor ....................................................................................................... 3-21
3.7.1 Mechanical Height Sensor....................................................................................... 3-22
3.7.2 Laser Height Sensor (Option) .................................................................................. 3-22
3.7.3 Probe Adjustments .................................................................................................. 3-24
3.7.3.1 Centering the Micrometer Locking Screw ............................................................... 3-24
3.7.3.2 Minor Probe Height Adjustment .............................................................................. 3-26
3.7.3.3 Major Probe Height and Probe-to-Needle Distance Adjustments ........................... 3-28
3.8 Needle Sensor ...................................................................................................... 3-30
3.9 Fluid Heaters ........................................................................................................ 3-32
3.9.1 Needle Heater ......................................................................................................... 3-32
3.9.1.1 Needle Heater Installation ....................................................................................... 3-32
3.9.2 DJ-9000 Series Nozzle Thermal Control Assembly ................................................ 3-34
3.9.2.1 Thermal Control Assembly Installation .................................................................... 3-34
3.10 Weigh Station ....................................................................................................... 3-35
3.11 Purge Station ........................................................................................................ 3-35
3.12 Options ................................................................................................................. 3-36
3.12.1 Dual-Action Dispensing Head ................................................................................. 3-36
3.12.2 Heater Tooling ......................................................................................................... 3-37
3.12.2.1 Contact Heaters ................................................................................................... 3-38
3.12.2.2 Flexible Impingement Heaters ............................................................................. 3-39
3.12.2.3 Process Development Hot Plate (X-1020) .......................................................... 3-40
3.12.3 SECS/GEM Interface Software ............................................................................... 3-41
3.12.4 CADImport Software ................................................................................................ 3-41
3.12.5 Low Fluid Sensors ................................................................................................... 3-42
3.12.5.1 Capacitive Fluid Level Sensor ............................................................................. 3-42
3.12.5.2 Magnetic Fluid Level Sensor ............................................................................... 3-43
3.12.6 Under-Board Support System ................................................................................. 3-44
3.12.7 Free-Standing Loader (FSL) ................................................................................... 3-45
3.12.8 Wafer Handler System (WHS) ................................................................................ 3-46
4 OPERATION ........................................................................................................ 4-1
4.1 Overview ................................................................................................................4-1
4.2 Theory of Operation ................................................................................................4-1
4.2.1 Basic System Description .......................................................................................... 4-1
4.2.2 Human-Machine Interface ......................................................................................... 4-2
4.2.3 Typical Dispensing Process ...................................................................................... 4-3