Datasheet

Page 52 of 161
nRF8001 Product Specification
Revision 1.2
17.2 Layout
17.3 Bill of Materials
Table 24. Bill of materials, with DC/DC converter enabled
No components
on bottom layer
Top silk screen
Top view Bottom view
Designator Value Footprint Comment
C1, C2 12 pF 0402 NP0 ± 2%
C3 2.2 nF 0402 X7R ± 10%
C4 NA 0402 Not mounted
C5 1.8 pF 0402 NP0 ± 0.1 pF
C6 1.2 pF 0402 NP0 ± 0.1 pF
C7 1.0 µF 0603 X5R ± 10%
C8 1.0 nF 0402 X7R ± 10%
C9 4.7 µF 0603 X5R ± 10%
C10, C12 100 nF 0402 X7R ± 10%
C11 33 nF 0402 X7R ± 10%
L1 8.2 nH 0402 High frequency chip inductor ± 5%
L2 5.6 nH 0402 High frequency chip inductor ± 5%
L3 3.9 nH 0402 High frequency chip inductor ± 5%
L4 10 µH 0603 Chip inductor, I
DC,min
= 50 mA, ± 20%
L5 15 nH 0402 High frequency chip inductor ± 10%
R1 22 k 0402 Resistor, ± 1%, 0.063 W
U1 nRF8001 QFN32 QFN32 5×5 mm package
X1 16 MHz 3.2 × 2.5 mm SMD-3225, 16 MHz, CL=9 pF, ± 40 ppm