Datasheet
Page 14 of 161
nRF8001 Product Specification
Revision 1.2
5 Physical product overview
This section describes the physical properties of nRF8001.
5.1 Package and pin assignment
nRF8001 is available in a 5 x 5 mm QFN32 package. The backplate of the QFN32 capsule must be
grounded to the application PCB in order to achieve optimal performance. The physical dimensions of
nRF8001 are presented in Chapter 15 on page 49
.
Figure 3.
shows the pin assignment for nRF8001 and Table 1. on page 15 describes the pin functionality.
Figure 3. nRF8001 pin assignment (top view)
1
2
3
4
5
6
7
8
13
14
15
16
9
10
11
12
17
18
19
20
21
22
23
24
2
5
2
6
2
7
2
8
2
9
3
0
3
1
3
2
VDD
DEC1
DEC2
VDD
SCK
MOSI
MISO
N/C
AVDD
VSS
ANT2
ANT1
VDD_PA
RESET
VSS
DCC
XC1
XC2
AVDD
IREF
XL2
XL1
ACTIVE
AVDD
VSS
VSS
REQN
RDYN
TXD
RXD
VSS
VSS
nRF8001
QFN32
(5x5 mm)
exposed die pad, connect to VSS