User Guide

Device memories

RAP memories NOR flash and SDRAM

POP2 memory is stacked on the RAP. Modem memory consists of 128 Mbit SDRAM and 128 Mbit NOR flash

memories.

Combo memory

The application memory of the device consists of NAND/DDR combo memory. The stacked DDR/NAND

application memory has 512 Mbit of DDR memory and 1024 Mbit of flash memory.

Audio concept

Audio HW architecture

The functional core of the audio hardware is built around two ASICs: RAP CMT engine ASIC and the mixed

signal EM ASIC N2200. Due to stereo IHF solution there is also analog switch N2100 to control the audio signal

to system connector.

There are four audio transducers:

• 7mm x 11mm dynamic earpiece

• 2 pcs 11 x 15 mm dynamic speaker

• electret microphone module

All galvanic audio accessories are connected to the system connector accessory connector.

A Bluetooth audio module that is connected to RAP supports Bluetooth audio functionality.

There is a separate application processor for Symbian applications.

Figure 96 Audio HW block diagram

Internal microphone

The internal microphone is used for HandPortable (HP) and Internal HandsFree (IHF) call modes.

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