User Guide

Table of Contents
Baseband description ......................................................................................................................................... 10–7
Baseband functional description.................................................................................................................. 10–7
Absolute maximum ratings........................................................................................................................... 10–7
Phone modes of operation............................................................................................................................ 10–7
Power distribution......................................................................................................................................... 10–9
Clocking scheme........................................................................................................................................... 10–10
Bluetooth ...................................................................................................................................................... 10–11
FM radio......................................................................................................................................................... 10–12
USB................................................................................................................................................................. 10–13
SIM interface ................................................................................................................................................. 10–13
IrDA interface................................................................................................................................................ 10–14
Mini SD card interface .................................................................................................................................. 10–14
WLAN interface ............................................................................................................................................. 10–14
DVB-H interface............................................................................................................................................. 10–15
Battery interface........................................................................................................................................... 10–16
Camera interfaces......................................................................................................................................... 10–17
Main camera interface............................................................................................................................ 10–17
Main camera specifications.................................................................................................................... 10–17
Front camera specifications................................................................................................................... 10–17
Flash LED................................................................................................................................................... 10–18
User interface................................................................................................................................................ 10–18
Phone position sensors ............................................................................................................................... 10–18
Keyboards ..................................................................................................................................................... 10–19
Display interface........................................................................................................................................... 10–20
Display and keyboard backlight.................................................................................................................. 10–20
ASICs............................................................................................................................................................... 10–21
RAP3GS ASIC ............................................................................................................................................. 10–21
Application engine processor ................................................................................................................ 10–21
EM ASIC N2200 ......................................................................................................................................... 10–21
EM ASIC N2300 ......................................................................................................................................... 10–21
Device memories.......................................................................................................................................... 10–22
RAP memories NOR flash and SDRAM.................................................................................................... 10–22
Combo memory....................................................................................................................................... 10–22
Audio concept.................................................................................................................................................... 10–22
Audio HW architecture................................................................................................................................. 10–22
Internal microphone.................................................................................................................................... 10–22
External microphone.................................................................................................................................... 10–23
Internal earpiece.......................................................................................................................................... 10–23
External earpiece.......................................................................................................................................... 10–23
Internal handsfree speaker......................................................................................................................... 10–25
System connector......................................................................................................................................... 10–26
Baseband technical specifications................................................................................................................... 10–28
External interfaces ....................................................................................................................................... 10–28
List of external interfaces....................................................................................................................... 10–28
ACI interface electrical characteristics .................................................................................................. 10–28
VOUT electrical characteristics ............................................................................................................... 10–28
USB IF electrical characteristics.............................................................................................................. 10–29
FBUS interface electrical characteristics (between RAP and N2300) ................................................. 10–29
Headset hook detection interface (XMICN) electrical characteristics................................................. 10–30
Audio signal electrical characteristics................................................................................................... 10–30
RM-100
System Module Nokia Customer Care
Issue 2 COMPANY CONFIDENTIAL Page 10 –3
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