User Guide

Figure 3 OMAP1710 high level block diagram

Section Description

Helen3 (OMAP1710) processor also called an application ASIC because it is

processing application SW and handles the UI SW. It

consists of OMAP3.3 and peripheral subsystems like

camera, display and keyboard driver blocks.

OMAP3.3 consists of ARM926 (MPU subsystem), TMS320C55x

(DSP subsystem), DMA and OMAP3.3s internal

peripherals.

Helen3 (OMAP1710) MPU subsystem based on an ARM926EJ. MPU is able to perform most

of the application operations on the chip.

System DMA component mainly used to help the MPU and DSP perform data

memory transfer-specific tasks, leaving more

available MIPS for both processors.

DSP subsystem based on a TMS320C55x™ DSP core, which is

responsible for intensive data computing tasks like

real-time audio and video handling on application

side, e.g. voice recording.

Internal memory subsystem composed of a single port SRAM.

Secure modules Helen3 (OMAP1710) contains a set of several

components, including ROM, a single port SRAM, and

eFUSE cells. These components enable the system to

support secure applications.

Memory interfaces The memory interfaces define the system memory

access organization of Helen3 (OMAP1710).

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