User Guide

Figure 86 Interconnections between the application processor, power ASIC and IR module

Pin Name I/O (IR module) Connection Description

1 LEDA Battery voltage VBAT IR TX LED anode

from VBAT through

load resistor

2 TxD I Application

processor

ETMPkt4 Transmit data

input to IR Module

3 RxD O Application

processor

ETMPkt3 Received data

output from IR

Module

4 SD I Application

processor

ETMPkt1 Shut Down

5 VCC EM ASIC

(N2200)

VAUX IR Module supply

voltage, 2.5V, later

2.78V.

6 GND GND IR module Ground

7 GND GND Ground (only in

lifting PWB)

8 GND GND Ground (only in

lifting PWB)

SIM interface

The device has one SIM (Subscriber Identification Module) interface. It is only accessible if battery is removed.

The SIM interface consists of an internal interface between RAP and EM ASIC (N2200), and of an external

interface between N2200 and SIM contacts.

The SIM IF is shown in the following figure:

RM-10;RM-24

Nokia Customer Care System Module

Page 9 –14 COMPANY CONFIDENTIAL Issue 1