User Guide

Table of Contents
Baseband description............................................................................................................................................9–7
System module block diagram........................................................................................................................9–7
Baseband functional description.....................................................................................................................9–7
Absolute maximum ratings..............................................................................................................................9–9
Phone modes of operation...............................................................................................................................9–9
Power distribution..........................................................................................................................................9–11
Bluetooth.........................................................................................................................................................9–12
USB....................................................................................................................................................................9–12
WLAN................................................................................................................................................................9–12
WLAN signals and interfaces..........................................................................................................................9–13
WLAN BB/MAC..................................................................................................................................................9–13
IrDA...................................................................................................................................................................9–13
SIM interface....................................................................................................................................................9–14
MiniSD...............................................................................................................................................................9–15
Battery interface..............................................................................................................................................9–17
Flip qwerty keyboard......................................................................................................................................9–18
Bluetooth RF....................................................................................................................................................9–19
SD card..............................................................................................................................................................9–21
User interface..................................................................................................................................................9–21
Display interface.........................................................................................................................................9–21
Keyboard.....................................................................................................................................................9–21
Display and keyboard backlight...............................................................................................................9–22
ALS interface...............................................................................................................................................9–22
ASICs.................................................................................................................................................................9–23
RAP ASIC.......................................................................................................................................................9–23
EM ASIC N2200............................................................................................................................................9–23
EM ASIC N2300............................................................................................................................................9–24
Device memories.............................................................................................................................................9–24
RAP memories NOR flash and SDRAM.......................................................................................................9–24
Combo memory..........................................................................................................................................9–24
Audio concept.......................................................................................................................................................9–24
Audio HW architecture....................................................................................................................................9–24
Internal microphone.......................................................................................................................................9–25
External microphone.......................................................................................................................................9–26
Internal earpiece.............................................................................................................................................9–26
Internal speaker..............................................................................................................................................9–27
External earpiece.............................................................................................................................................9–27
Vibra circuitry..................................................................................................................................................9–28
System connector............................................................................................................................................9–28
Baseband technical specifications......................................................................................................................9–29
External interfaces..........................................................................................................................................9–29
Headset hook detection interface (XMICN) electrical characteristics.........................................................9–29
Audio signal electrical characteristics...........................................................................................................9–30
SIM IF connections...........................................................................................................................................9–30
RS MMC interface connections........................................................................................................................9–30
Charger connector and charging interface connections & electrical characteristics...............................9–31
Internal interfaces...........................................................................................................................................9–32
Display connector and interface connections..............................................................................................9–33
Back-up battery interface connections and electrical characteristics.......................................................9–35
RF description.......................................................................................................................................................9–35
RM-10;RM-24
System Module Nokia Customer Care
Issue 1 COMPANY CONFIDENTIAL Page 9 –3
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