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• Regulators

• Vibra interface

• Digital interface (CBUS)

EM ASIC N2300

The EM ASIC (N2300) includes the following functional blocks:

• Core supply generation

• Charge control circuitry

• Level shifter and regulator for USB/FBUS

• Current gauge for battery current measuring

• Digital interface (CBUS)

Device memories

RAP3GS memory POP2 stacked NOR flash and DDRAM

Modem memory consists of 128 Mbit DDRAM and 128 Mbit NOR flash memories. Memories are in same POP2

package and it is stacked on to RAP3GS.

DDRAM is a dynamic memory for ISA SW.

NOR is used for ISA SW code and PM data and CDSP (Cellular Digital Signal Processor) SW code.

Combo memory

The application memory of the device consists of NAND/DDR combo memory. The stacked DDR/NAND

application memory has 512 Mbit of DDR memory and 1024 Mbit of flash memory.

Audio concept

Audio HW architecture

The functional core of the audio hardware is built around two ASICs: RAP 3G CMT engine ASIC and the mixed-

signal ASIC EM ASIC N2200.

EM ASIC N2200 provides an interface for the transducers and the accessory connector. Because audio

amplifiers are also integrated into EM ASIC N2200, the only discrete electronics components needed for audio

paths are audio filtering components and EMC/ESD components.

There are three audio transducers:

• 7x11mm dynamic earpiece

• 20mm dynamic speaker

• electret microphone module

In addition to the audio transducers, EM ASIC N2200 also provides an output for the dynamic vibra component.

All galvanic audio accessories are connected to the Pop-Port™ accessory connector.

A Bluetooth audio module (BC02 BRF 6150) that is connected to RAP3GS supports Bluetooth audio

functionality.

There is a separate application ASIC, OMAP 1710, for Symbian applications.

RM-208

System Module Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 9 –19