User Guide

PAMS
Technical Documentation
RAE-3
3. RF+System Module BL8
Page 3 – 7
issue 1 06/01
HAGAR Direct conversion RF ASIC – used in bl8 RF HW
HF Hands Free
HSCSD High Speed Circuits Switched Data
HW Hardware
IC Integrated Circuit
ICE In–Circuit Emulator
INL Integral non–linearity
IO Input/Output
IR Infrared
IrDA Infrared Data Association
JTAG Joint Test Action Group, commonly used as a synonym
for boundary scan (IEEE 1149.1) testing
LCD Liquid Crystal Display
LEAD Low power Enhanced Architecture DSP
LEAD2 Digital Signal Processor block of MADLinda
LMM LEAD2 MegaModule – DSP module in MADLinda
MAD MCU+ASIC+DSP chip (MCU–ASIC–DSP)
MAD2 GSM version of MAD
MAD2PR1 A pin reduction version of the MAD2
MAD2WD1 High Speed Data version of MAD2 by Wireless Data
MADLinda MAD based version of RAE-3 Communicator ASIC
MBUS 1–wire half duplex serial bus in NOKIA’s phones
MCU Micro Controller Unit
MFI Modulator and filter interface in MAD2
MMC MultiMediaCard
MMU Memory Management Unit
MPU Micro Processor Unit
– in text refers to MADLinda’s ARM9 processor
NTC Negative Temperature Coefficient (resistor)
PCI Phone Control Interface
PCM Pulse Code Modulation
PCR Pin Configuration Register in MADLinda
PDA Personal Digital Assistant
PHF Personal Hands Free
PLL Phase Locked Loop
PMM Permanent Memory Management block (Plato UI)
PPM Post Programmable Memory
PUP PIO, USART and PWM block of MADLinda
PWB Printed Wiring Board
PWM Pulse Width Modulation
R&D Research and development
RAM Random Access Memory
RF Radio Frequency
RFI RF Interface
ROM Read Only Memory
RTC Real Time Clock
SCU Synthesizer Control Unit