User Guide

PAMS
Technical Documentation
RAE-3
2. General Information
Page 2 – 6
Issue 1 06/01
MMC Card
SIM Card
Figure 3: MMC and SIM Cards
The RAE–3 is running both PDA and phone software in a single RISC CPU.
The RAE
–3 is also using EPOC32 operating system based software platform.
(EPOC32 is an operating system from Psion Software Inc.)
NOTE: Due to the infrared data link the RAE–3 is officially specificed as :
CLASS 1 LASER PRODUCT.
See IEC 60825–1 specification 825–1; Labelling, 5.1 General 5.2 Class 1.
List Of Modules
The bottom assembly contains one electronic module. This contains a single
PWB (BL8 ). This PWB is common for all European language variants and will
be updated with a different memory configuration for the Chinese variants.
Name of module Type code Notes
RF & System Module BL8 Standard BL8 PWB with FLASH memories
Keyboard and hinge flex
module
UL8 Module built up from FL1 FPC, AF8 audio
PWB and connectors
UI Module DL2 PDA & CMT displays built onto UL2 PWB
Mechanics MRAE–3 All mechanical parts excluding language de-
pendant parts, like QWERTY–Keymat and
some others.
For variant information kindly refer to the Variants section of this manual.